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STB200N4F3(2009) Просмотр технического описания (PDF) - STMicroelectronics

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STB200N4F3 Datasheet PDF : 14 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Electrical characteristics
2
Electrical characteristics
STB200N4F3, STP200N4F3
(TCASE = 25 °C unless otherwise specified)
Table 4. On/off states
Symbol
Parameter
Test conditions
Min. Typ. Max. Unit
V(BR)DSS
Drain-source breakdown
voltage
ID = 250 µA, VGS = 0
40
V
IDSS
Zero gate voltage drain
current (VGS = 0)
VDS = Max rating,
VDS = Max rating @125 °C
10 µA
100 µA
t(s) IGSS
Gate body leakage current
(VDS = 0)
VGS = ± 20 V
±100 nA
c VGS(th) Gate threshold voltage
VDS = VGS, ID = 250 µA
2
4
V
Produ RDS(on)
Static drain-source on
resistance
VGS = 10 V, ID= 60 A
D²PAK
TO-220
0.0025 0.0031
0.0030 0.0035
olete Table 5. Dynamic
bs Symbol
Parameter
Test conditions
- O gfs (1)
t(s) Ciss
Coss
uc Crss
Forward transconductance
Input capacitance
Output capacitance
Reverse transfer
capacitance
VDS = 10 V, ID = 80 A
VDS = 25 V, f = 1 MHz,
VGS = 0
rod Qg Total gate charge
P Qgs Gate-source charge
Qgd Gate-drain charge
VDD = 20 V, ID = 120 A
VGS = 10 V
(see Figure 14)
Obsolete1. Pulsed: pulse duration=300µs, duty cycle 1.5%
Min.
-
Typ.
200
Max. Unit
-
S
5100
pF
- 1270 -
pF
37
pF
75
-
23
17
nC
-
nC
nC
4/14
Doc ID 13302 Rev 3

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