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PBSS5330PAS Просмотр технического описания (PDF) - NXP Semiconductors.

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производитель
PBSS5330PAS
NXP
NXP Semiconductors. 
PBSS5330PAS Datasheet PDF : 18 Pages
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PBSS5330PAS
30 V, 3 A PNP low VCEsat (BISS) transistor
11 September 2014
Product data sheet
1. General description
PNP low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra
thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic
package with medium power capability and visible and soldarable side pads.
NPN complement: PBSS4330PAS
2. Features and benefits
Low collector-emitter saturation voltage VCEsat
High collector current capability IC and ICM
High collector current gain (hFE) at high IC
High efficiency due to less heat generation
High temperature applications up to 175 °C
Reduced Printed-Circuit Board (PCB) area requirements
Leadless small SMD plastic package with soldarable side pads
Exposed heat sink for excellent thermal and electrical conductivity
Suitable for Automatic Optical Inspection (AOI) of solder joint
AEC-Q101 qualified
3. Applications
Loadswitch
Battery-driven devices
Power management
Charging circuits
Power switches (e.g. motors, fans)
4. Quick reference data
Table 1.
Symbol
VCEO
IC
ICM
RCEsat
Quick reference data
Parameter
Conditions
collector-emitter
voltage
open base
collector current
peak collector current
collector-emitter
saturation resistance
single pulse; tp ≤ 1 ms
IC = -3 A; IB = -300 mA; pulsed;
tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C
Min Typ Max Unit
-
-
-30 V
-
-
-3
A
-
-
-5
A
-
75
107 mΩ
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