74LVC3G07DC Просмотр технического описания (PDF) - NXP Semiconductors.

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Компоненты Описание

производитель

74LVC3G07DC

Triple buffer with open-drain output

NXP Semiconductors. 

NXP Semiconductors

74LVC3G07

Triple buffer with open-drain output

VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm

SOT765-1

D

y

Z

8

5

pin 1 index

E

c

HE

A A2

A1

1

e

4

bp

wM

detail X

A

X

vM A

Q

(A3)

θ

Lp

L

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

A

max.

A1

A2

A3

bp

c

D(1) E(2)

e

HE

mm

1

0.15

0.00

0.85

0.60

0.12

0.27

0.17

0.23

0.08

2.1

1.9

2.4

2.2

0.5

3.2

3.0

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

IEC

SOT765-1

REFERENCES

JEDEC

JEITA

MO-187

L

Lp

Q

v

w

y

Z(1)

θ

0.4

0.40 0.21

0.15 0.19

0.2

0.13

0.1

0.4

0.1

8°

0°

EUROPEAN

PROJECTION

ISSUE DATE

02-06-07

Fig 11. Package outline SOT765-1 (VSSOP8)

74LVC3G07

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 11 — 9 April 2013

© NXP B.V. 2013. All rights reserved.

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