AD9393BBCZ-80 Просмотр технического описания (PDF) - Analog Devices
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производитель
AD9393BBCZ-80 Datasheet PDF : 40 Pages
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AD9393
OUTLINE DIMENSIONS
*1.40 MAX
6.10
6.00 SQ
5.90
BALL A1
PAD CORNER
TOP VIEW
DETAIL A
4.50
BSC SQ
0.50
BSC
0.75
REF
0.15 MIN
A1 CORNER
INDEX AREA
10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
BOTTOM VIEW
DETAIL A
0.65 MIN
0.35 SEATING
0.30 PLANE
0.25
BALL DIAMETER
*COMPLIANT TO JEDEC STANDARDS MO-225
WITH THE EXCEPTION TO PACKAGE HEIGHT.
Figure 9. 76-Pin Chip Scale Package Pin Grid Array [CSP_BGA]
6 mm × 6 mm × 1.2 mm
(BC-76-2)
Dimensions shown in millimeters
COPLANARITY
0.08 MAX
ORDERING GUIDE
Model
Max Speed
(MHz) Digital
AD9393BBCZ-801
80
AD9393BBCZRL-801 80
AD9393/PCBZ1
1 Z = RoHS Compliant Part.
Temperature
Range
−10°C to +80°C
−10°C to +80°C
Package Description
76-Pin Chip Scale Package Pin Grid Array (CSP_BGA)
76-Pin Chip Scale Package Pin Grid Array (CSP_BGA)
Evaluation Board
Package Option
BC-76-2
BC-76-2
Rev. 0 | Page 37 of 40
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