ADA4853-3YCPZ-RL Просмотр технического описания (PDF) - Analog Devices
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производитель
ADA4853-3YCPZ-RL
Analog Devices
ADA4853-3YCPZ-RL Datasheet PDF : 16 Pages
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ADA4853-1/ADA4853-2/ADA4853-3
OUTLINE DIMENSIONS
2.20
5.10
2.00
5.00
1.80
4.90
1.35
6
5
4
2.40
1.25
2.10
1.15
1
2
3
1.80
PIN 1
1.30 BSC
1.00
0.90
0.70
0.65 BSC
1.10
0.40
0.80
0.10
0.46
0.10 MAX
0.30
0.22
0.15
SEATING
PLANE
0.08
0.36
0.26
0.10 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-203-AB
Figure 52. 6-Lead Thin Shrink Small Outline Transistor Package [SC70]
(KS-6)—Dimensions shown in millimeters
14
4.50
4.40
4.30
8
6.40
BSC
1
7
PIN 1
1.05
0.65
1.00
BSC
0.80
1.20 0.20
MAX 0.09
0.75
0.15 0.30
0.05 0.19
8°
SEATING
PLANE
0°
COPLANARITY
0.10
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
Figure 53. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)—Dimensions shown in millimeters
PIN 1
INDICATOR
3.00
BSC SQ
TOP
VIEW
2.75
BSC SQ
0.50
0.40
0.60 MAX
0.30
0.45
13
12
16 1
EXPOSED
PAD
PIN 1
INDICATOR
*1.65
1.50 SQ
1.35
0.50
BSC
9 (BOTTOM VIEW) 4
8
5
0.25 MIN
12° MAX
0.90
0.85
0.80
SEATING
PLANE
0.30
0.23
0.18
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
1.50 REF
*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
Figure 54. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad (CP-16-3)—Dimensions shown in millimeters
ORDERING GUIDE
Model
ADA4853-1AKSZ-R21
ADA4853-1AKSZ-R71
ADA4853-1AKSZ-RL1
ADA4853-2YCPZ-R21
ADA4853-2YCPZ-RL1
ADA4853-2YCPZ-RL71
ADA4853-3YCPZ-R21
ADA4853-3YCPZ-RL1
ADA4853-3YCPZ-R71
ADA4853-3YRUZ1
ADA4853-3YRUZ-RL1
ADA4853-3YRUZ-R71
Temperature
Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
Package Description
6-Lead Thin Shrink Small Outline Transistor Package (SC70)
6-Lead Thin Shrink Small Outline Transistor Package (SC70)
6-Lead Thin Shrink Small Outline Transistor Package (SC70)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
14-Lead Think Shrink Small Outline Package (TSSOP)
14-Lead Think Shrink Small Outline Package (TSSOP)
14-Lead Think Shrink Small Outline Package (TSSOP)
Ordering
Quantity
250
3,000
10,000
250
5,000
1,500
250
5,000
1,500
96
2,500
1,000
Package
Option
KS-6
KS-6
KS-6
CP-16-3
CP-16-3
CP-16-3
CP-16-3
CP-16-3
CP-16-3
RU-14
RU-14
RU-14
Branding
HEC
HEC
HEC
H0H
H0H
H0H
H0L
H0L
H0L
1 Z = Pb-free part.
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05884-0-10/06(B)
Rev. B | Page 16 of 16
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