ADCMP563/ADCMP564
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagrams............................................................. 1
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
Thermal Considerations.............................................................. 5
ESD Caution.................................................................................. 5
Pin Configurations and Function Descriptions ........................... 6
Typical Performance Characteristics ............................................. 8
REVISION HISTORY
4/16—Rev. C to Rev. D
Changes to Figure 4 .......................................................................... 1
Changes to Figure 7 .......................................................................... 6
Updates Outline Dimensions........................................................ 15
Changes to Ordering Guide .......................................................... 15
6/11—Rev. B to Rev. C
Changes to Figure 4 .......................................................................... 1
Changes to Figure 7 and LFCSP Pin Numbers (Table 3) ............ 6
Updated Outline Dimensions ....................................................... 14
Changes to Ordering Guide .......................................................... 15
5/05—Rev. A to Rev. B
Added 16-Lead LFCSP.......................................................Universal
Changes to Applications .................................................................. 1
Data Sheet
Timing Information ....................................................................... 10
Application Information................................................................ 11
Clock Timing Recovery............................................................. 11
Optimizing High Speed Performance ..................................... 11
Comparator Propagation Delay Dispersion............................... 11
Comparator Hysteresis .............................................................. 12
Minimum Input Slew Rate Requirement ................................ 12
Typical Application Circuits ......................................................... 13
Outline Dimensions ....................................................................... 14
Ordering Guide .......................................................................... 15
Changes to Table 1.............................................................................3
Changes to Optimizing High Speed Performance Section....... 11
Changes to Comparator Hysteresis Section................................ 12
Changes to Minimum Input Slew Rate Requirement Section . 12
Changes to Ordering Guide .......................................................... 14
7/04—Rev. 0 to Rev. A
Changes to Specification Table ........................................................4
Changes to Figure 14.........................................................................9
Changes to Figure 21...................................................................... 12
Changes to Figure 23...................................................................... 13
4/04—Revision 0: Initial Version
Rev. D | Page 2 of 15