ADP1051
ABSOLUTE MAXIMUM RATINGS
Table 2. Absolute Maximum Rating
Parameter
Rating
Supply Voltage (Continuous) VDD
4.2 V
Digital Pins: OUTA, OUTB, OUTC, −0.3 V to VDD + 0.3 V
OUTD, SR1, SR2, PG/ALT#, SDA, SCL
VS- to AGND
−0.3 V to +0.3 V
VS, VF, OVP, RTD, ADD, CS1, CS2+, −0.3 V to VDD + 0.3 V
CS2-
SYNI/FLGI, CTRL
Operating Temperature Range
−0.3 V to VDD + 0.3 V
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature
150 °C
Peak Solder Reflow Temperature
SnPb Assemblies (10 to 30 secs)
RoHS Compliant Assemblies
(20 to 40 secs)
ESD Charged Device Model
ESD Human Body Model
240 °C
260 °C
1.5 kV
5.0 kV
Stresses above those listed under Absolute Maximum Ratings may
cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions
above those indicated in the operational section of this
specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Preliminary Technical Data
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
θJC
24 Lead LFCSP
36.26
1.51
Unit
°C/W
SOLDERING
It is important to follow the correct guidelines when laying out the
PCB footprint for the ADP1051, and for soldering the part onto the
PCB. For detailed information about these guidelines, see the AN-
772 Application Note.
ESD CAUTION
Rev. PrA | Page 8 of 17