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ADP3164 Просмотр технического описания (PDF) - Analog Devices

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ADP3164 Datasheet PDF : 16 Pages
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ADP3164
13. Whenever a power dissipating component (e.g., a power
MOSFET) is soldered to a PCB, the liberal use of vias,
both directly on the mounting pad and immediately sur-
rounding it, is recommended. Two important reasons for
this are: improved current rating through the vias, and
improved thermal performance from vias extended to the
opposite side of the PCB where a plane can more readily
transfer the heat to the air.
14. The output power path, though not as critical as the switch-
ing power path, should also be routed to encompass a small
area. The output power path is formed by the current path
through the inductor, the current sensing resistor, the out-
put capacitors, and back to the input capacitors.
15. For best EMI containment, the power ground plane should
extend fully under all the power components except the out-
put capacitors. These components are: the input capacitors,
the power MOSFETs and Schottky diodes, the inductors,
the current sense resistor, and any snubbing element that
might be added to dampen ringing. Avoid extending the
power ground under any other circuitry or signal lines,
including the voltage and current sense lines.
Signal Circuitry
16. The output voltage is sensed and regulated between the FB
pin and the GND pin (which connects to the signal ground
plane). The output current is sensed (as a voltage) by the
CS+ and CS– pins. In order to avoid differential mode
noise pickup in the sensed signal, the loop area should be
small. Thus the FB trace should be routed atop the signal
ground plane, and the CS+ and CS– pins (the CS+ pin
should be over the signal ground plane as well).
17. The CS+ and CS– traces should be Kelvin-connected to
the current sense resistor, so that the additional voltage
drop due to current flow on the PCB at the current sense
resistor connections, does not affect the sensed voltage.
–14–
REV. 0

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