CXA1787N Просмотр технического описания (PDF) - Sony Semiconductor

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производитель

CXA1787N

2GHz-band PLL IC for Mobile Communications

Sony Semiconductor 

Package Outline

Unit: mm

20PIN SSOP (PLASTIC)

∗6.5 ± 0.1

20

11

A

+ 0.2

1.25 – 0.1

0.1

CXA1787N

1

+ 0.1

0.22 – 0.05

10

0.65

0.13 M

+ 0.05

0.15 – 0.02

0.1 ± 0.1

0° to 10°

NOTE: Dimension “∗” does not include mold protrusion.

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

SSOP-20P-L01

SSOP020-P-0044

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER / PALLADIUM

PLATING

42/COPPER ALLOY

0.1g

NOTE : PALLADIUM PLATING

This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).

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