BS801C Просмотр технического описания (PDF) - Holtek Semiconductor
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BS801C Datasheet PDF : 21 Pages
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SOP 20W
Symbol
W
P
E
F
D
D1
P0
P1
A0
B0
K0
t
C
Description
Carrier Tape Width
Cavity Pitch
Perforation Position
Cavity to Perforation (Width Direction)
Perforation Diameter
Cavity Hole Diameter
Perforation Pitch
Cavity to Perforation (Length Direction)
Cavity Length
Cavity Width
Cavity Depth
Carrier Tape Thickness
Cover Tape Width
SSOP 20S (150mil)
Symbol
W
Description
Carrier Tape Width
P
Cavity Pitch
E
Perforation Position
F
Cavity to Perforation (Width Direction)
D
Perforation Diameter
D1
Cavity Hole Diameter
P0
Perforation Pitch
P1
Cavity to Perforation (Length Direction)
A0
Cavity Length
B0
Cavity Width
K0
Cavity Depth
t
Carrier Tape Thickness
C
Cover Tape Width
BS801C/02C/04C/06C/08C
Dimensions in mm
24.0 +0.3/-0.1
12.0±0.1
1.75±0.10
11.5±0.1
1.5 +0.1/-0.0
1.50 +0.25/-0.00
4.0±0.1
2.0±0.1
10.8±0.1
13.3±0.1
3.2±0.1
0.30±0.05
21.3±0.1
Dimensions in mm
16.0 +0.3/-0.1
8.0±0.1
1.75±0.10
7.5±0.1
1.5 +0.1/-0.0
1.50 +0.25/-0.00
4.0±0.1
2.0±0.1
6.5±0.1
9.0±0.1
2.3±0.1
0.30±0.05
13.3±0.1
Rev. 1.00
19
December 2, 2009
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