BSP135L6906 Просмотр технического описания (PDF) - Infineon Technologies
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BSP135L6906 Datasheet PDF : 9 Pages
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BSP135
Parameter
Thermal characteristics
Symbol Conditions
min.
Values
typ.
Unit
max.
Thermal resistance,
junction - soldering point (pin 4)
R thJS
-
SMD version, device on PCB
R thJA minimal footprint
-
6 cm2 cooling area2)
-
Electrical characteristics, at T j=25 °C, unless otherwise specified
-
25 K/W
-
115
-
70
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Drain-source cutoff current
Gate-source leakage current
On-state drain current
Drain-source on-state resistance
Transconductance
V (BR)DSS V GS=-3 V, I D=250 µA
V GS(th) V DS=3 V, I D=94 µA
I D(off)
V DS=600 V,
V GS=-3 V, T j=25 °C
V DS=600 V,
V GS=-3 V, T j=125 °C
I GSS
V GS=20 V, V DS=0 V
I DSS
V GS=0 V, V DS=10 V
R DS(on) V GS=0 V, I D=0.01A
V GS=10 V, I D=0.12 A
g fs
|V DS|>2|I D|R DS(on)max,
I D=0.1 A
600
-2.1
-
-
-
20
-
-
0.08
-
-1.4
-
-
-
-
30
25
0.16
-V
-1
0.1 µA
10
100 nA
- mA
60 Ω
45
-S
Threshold voltage V GS(th) sorted in bands3)
J
V GS(th) V DS=3 V, I D=94 µA
-1.2
-
-1 V
K
-1.35
-
-1.15
L
-1.5
-
-1.3
M
-1.65
-
-1.45
N
-1.8
-
-1.6
2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (single layer, 70 µm thick) copper area for
drain connection. PCB is vertical in still air.
3) Each reel contains transistors out of one band whose identifying letter is printed on the reel label. A specific
band cannot be ordered separately.
Rev. 1.31
page 2
2010-07-19
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