CA3290 Просмотр технического описания (PDF) - Intersil
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CA3290 Datasheet PDF : 10 Pages
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CA3290, CA3290A
Metallization Mask Layout
0
90
10 20 30 40 50 53
80
7 70
6
60
10 50
40
11 30
12 20
87 - 95
(2.210 - 2.403)
4
10
10
4 - 10
(0.102 - 0.254)
2
50 - 58
(1.270 - 1.473)
The photographs and dimensions of each chip represent a chip
when it is part of the wafer. When the wafer is cut into chips, the
cleavage angles are 57o instead of 90o with respect to the face of
the chip. Therefore, the isolated chip is actually 7mils (0.17mm)
larger in both dimensions.
Dimensions in parentheses are in millimeters and are derived from
the basic inch dimensions as indicated. Grid graduations are in mils
(10-3 inch)
NOTE: Numbers in pads are for 8 lead DIP and TO-5 Can and
numbers outside of chip are for 14 lead DIP.
9
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