CXD4016R Просмотр технического описания (PDF) - Sony Semiconductor

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производитель

CXD4016R

Transmission Digital Signal Processor IC for Infrared Spatial Digital Audio Communication

Sony Semiconductor 

Package Outline

(Unit : mm)

48

49

64PIN LQFP (PLASTIC)

12.0 ± 0.2

10.0 ± 0.1

33

+ 0.2

1.5 – 0.1

32

CXD4016R

64

1

0.5

17

16

b

0.08 M

0.25

0.1 ± 0.1

A

0.08 S

S

0.20 ± 0.05

0° to 8°

DETAIL A

SONY CODE

JEITA CODE

JEDEC CODE

LQFP-64P-L023

P-LQFP64-10X10-0.5

DETAIL B

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

TERMINAL TREATMENT SOLDER PLATING

TERMINAL MATERIAL 42 ALLOY

PACKAGE MASS

0.32g

LEAD PLATING SPECIFICATIONS

ITEM

LEAD MATERIAL

SOLDER COMPOSITION

PLATING THICKNESS

SPEC.

42 ALLOY

Sn-2%Bi

5-20µm

- 31 -

Sony Corporation

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