SSM2135–SPECIFICATIONS (VS = +5 V, –40؇C < TA < +85؇C unless otherwise noted.
Typical specifications apply at TA = +25؇C.)
Parameter
Symbol Conditions
Min Typ Max
AUDIO PERFORMANCE
Voltage Noise Density
Current Noise Density
Signal-To-Noise Ratio
Headroom
Total Harmonic Distortion
en
in
SNR
HR
THD+N
f = 1 kHz
f = 1 kHz
20 Hz to 20 kHz, 0 dBu = 0.775 V rms
Clip Point = 1% THD+N, f = 1 kHz, RL = 10 kΩ
AV = +1, VO = 1 V p-p, f = 1 kHz, 80 kHz LPF
RL = 10 kΩ
RL = 32 Ω
5.2
0.5
121
5.3
0.003
0.005
DYNAMIC PERFORMANCE
Slew Rate
Gain Bandwidth Product
Settling Time
SR
GBW
tS
RL = 2 kΩ, TA = +25°C
to 0.1%, 2 V Step
0.6 0.9
3.5
5.8
INPUT CHARACTERISTICS
Input Voltage Range
Input Offset Voltage
Input Bias Current
Input Offset Current
Differential Input Impedance
Common-Mode Rejection
Large Signal Voltage Gain
VCM
VOS
IB
IOS
ZIN
CMR
AVO
VOUT = 2 V
VCM = 0 V, VOUT = 2 V
VCM = 0 V, VOUT = 2 V
0 V ≤ VCM ≤ 4 V, f = dc
0.01 V ≤ VOUT ≤ 3.9 V, RL = 600 Ω
0
+4.0
0.2 2.0
300 750
50
4
87 112
2
OUTPUT CHARACTERISTICS
Output Voltage Swing High
VOH
Output Voltage Swing Low
VOL
Short Circuit Current Limit
ISC
RL = 100 kΩ
RL = 600 Ω
RL = 100 kΩ
RL = 600 Ω
4.1
3.9
3.5
3.0
± 30
POWER SUPPLY
Supply Voltage Range
Power Supply Rejection Ratio
Supply Current
VS
PSRR
ISY
Single Supply
Dual Supply
VS = +4 V to +6 V, f = dc
VOUT = 2.0 V, No Load
VS = +5 V
VS = ± 18 V, VOUT = 0 V, No Load
+4
+36
±2
± 18
90 120
2.8 6.0
3.7 7.6
Units
nV/√Hz
pA/√Hz
dBu
dBu
%
%
V/µs
MHz
µs
V
mV
nA
nA
MΩ
dB
V/µV
V
V
mV
mV
mA
V
V
dB
mA
mA
ABSOLUTE MAXIMUM RATINGS
Supply Voltage
Single Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +36 V
Dual Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± VS
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . 10 V
Output Short Circuit Duration . . . . . . . . . . . . . . . . Indefinite
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Operating Temperature Range . . . . . . . . . . . –40°C to +85°C
Junction Temperature Range (TJ) . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
ESD RATINGS
883 (Human Body) Model . . . . . . . . . . . . . . . . . . . . . . . 1 kV
EIAJ Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 V
THERMAL CHARACTERISTICS
Thermal Resistance1
8-Lead Plastic DIP
θJA
θJC
8-Lead SOIC
θJA
θJC
103°C/W
43°C/W
158°C/W
43°C/W
1θJA is specified for worst case conditions, i.e., θJA is specified for device in
socket for P-DIP and device soldered in circuit board for SOIC package.
ORDERING GUIDE
Model
Temperature
Range
Package
Description
Package
Option
SSM2135P –40°C to +85°C 8-Lead Plastic DIP N-8
SSM2135S –40°C to +85°C 8-Lead SOIC
SO-8
–2–
REV. D