Electrical Specifications
VIN = 2.7V to 5.5V and TA = -40°C to +85°C unless otherwise noted. Typical values are at TA = 25°C and VIN = 3.6V.
Symbol
Parameter
Conditions
Min. Typ. Max. Units
Power Supplies
ISD Shutdown Supply Current
VUVLO Under-Voltage Lockout Threshold
VUVHYST Under-Voltage Lockout Hysteresis
EN: Enable Pin
EN = GND, VIN = 3.6V
VIN Rising
VIN Falling
0.30 0.75 μA
2.10 2.35 2.60 V
1.90 2.15 2.40 V
250
mV
VIH HIGH-Level Input Voltage
VIL LOW-Level Input Voltage
REN EN Pull-Down Resistance
tLO EN Low Time for Dimming
tHI Time Delay Between Steps
TSD EN Low, Shutdown Pulse Width
Feedback and Reference
1.2
200
VIN = 3.6V; See Figure 14
0.5
VIN = 3.6V; See Figure 14
0.5
VIN = 3.6V; from Falling Edge of EN 1
V
0.4
V
300
400 kΩ
300.0 µs
µs
ms
VFB Feedback Voltage
IFB Feedback Input Current
Power Outputs
ILED = 20mA from -40°C to +85°C,
2.7V ≤ VIN ≤ 5.5V
237
250
263 mV
VFB = 250mV
0.1
1.0
μA
RDS(ON)_Q1 Boost Switch On-Resistance
ISW(OFF) SW Node Leakage(2)
ILIM-PK Boost Switch Peak Current Limit
Oscillator
VIN = 3.6V, ISW = 100mA
VIN = 2.7V, ISW = 100mA
EN = 0, VIN = VSW = VOUT = 5.5V,
VLED = 0
VIN = 3.6V
600
mΩ
650
0.1
2.0
μA
750
mA
fSW
Boost Regulator Switching Frequency
Output and Protection
1.0
1.2
1.4 MHz
VOVP
Boost Output Over-Voltage Protection
OVP Hysteresis
22.5 24.5
V
1.0
VTLSC VOUT Short Circuit Detection Threshold VOUT Falling
VIN – 1.4
V
VTHSC
DMAX
DMIN
VOUT Short Circuit Detection Threshold
Maximum Boost Duty Cycle(3,4)
Minimum Boost Duty Cycle(3,4)
VOUT Rising
VIN – 1.2
V
85
%
20
%
TTSD Thermal Shutdown
150
°C
THYS Thermal Shutdown Hysteresis
35
°C
Notes:
2. SW leakage current includes the leakage current of two internal switches; SW to GND and SW to VOUT.
3. Not tested in production, but guaranteed by design
4. Application should guarantee that minimum and maximum duty cycle fall between 20-85% to meet the specified range.
© 2009 Fairchild Semiconductor Corporation
FAN5343 • Rev. 1.0.4
5
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