GS9090BCNE3 Просмотр технического описания (PDF) - Gennum -> Semtech
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GS9090BCNE3 Datasheet PDF : 71 Pages
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GS9090B Data Sheet
3.9.7 Error Detection and Indication ............................................................39
3.9.8 Additional Processing Functions.........................................................44
3.10 Internal FIFO Operation ..............................................................................47
3.10.1 Video Mode.......................................................................................47
3.10.2 DVB-ASI Mode .................................................................................48
3.10.3 Ancillary Data Extraction Mode.........................................................52
3.10.4 Bypass Mode ....................................................................................55
3.11 Parallel Data Outputs ..................................................................................55
3.11.1 Parallel Data Bus Output Buffers......................................................56
3.11.2 Parallel Output in SMPTE Mode .......................................................56
3.11.3 Parallel Output in DVB-ASI Mode.....................................................56
3.11.4 Parallel Output in Data-Through Mode .............................................56
3.12 Programmable Multi-Function Outputs .......................................................56
3.13 GS9090B Low-latency Mode ......................................................................58
3.14 GSPI Host Interface ....................................................................................59
3.14.1 Command Word Description.............................................................60
3.14.2 Data Read and Write Timing ............................................................60
3.14.3 Configuration and Status Registers ..................................................62
3.15 JTAG Operation ..........................................................................................62
3.16 Device Power Up ........................................................................................63
4. References & Relevant Standards.........................................................................65
5. Application Information...........................................................................................66
5.1 Typical Application Circuit (Part A) ...............................................................66
5.2 Typical Application Circuit (Part B) ...............................................................67
6. Package & Ordering Information............................................................................68
6.1 Package Dimensions ....................................................................................68
6.2 Recommended PCB Footprint ......................................................................69
6.3 Packaging Data.............................................................................................69
6.4 Marking Diagram...........................................................................................70
6.5 Ordering Information .....................................................................................70
7. Revision History .....................................................................................................71
40749 - 2 January 2007
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