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ISL59446(2006) Просмотр технического описания (PDF) - Intersil

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ISL59446 Datasheet PDF : 13 Pages
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ISL59446
Typical Performance Curves VS = ±5V, RL = 500Ω to GND, TA = 25°C, unless otherwise specified. (Continued)
HIZ
50Ω
TERM.
VIN = 0V
HIZ
50Ω
TERM.
VIN = 1V
0
0
VOUT A, B, C
20ns/DIV
FIGURE 25. HIZ SWITCHING GLITCH VIN = 0V
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
3
2.857W
2.5
QFN32
2
θJA = 35°C/W
1.5
1
0.5
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 27. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
0
VOUT A, B, C
0
20ns/DIV
FIGURE 26. HIZ TRANSIENT RESPONSE VIN = 1V
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.2
1
0.8
758mW
0.6
0.4
QFN32
θJA = 125°C/W
0.2
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 28. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
8
FN6261.0
May 19, 2006

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