ISL83385E
Absolute Maximum Ratings
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V
Input Voltages
TIN, SHDN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Information
Thermal Resistance (Typical, Note 3)
θJA (oC/W)
18 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
75
20 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
125
Moisture Sensitivity (see Technical Brief TB363)
All Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(SOIC, SSOP - Lead Tips Only)
Operating Conditions
Temperature Range
ISL83385ECX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
ISL83385EIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications TTeypsticCaolsnadrietioantsT:AV=CC25=o3CV to 5.5V, C1 - C4 = 0.1µF; Unless Otherwise Specified.
PARAMETER
TEST CONDITIONS
TEMP
(oC)
MIN
TYP
DC CHARACTERISTICS
Supply Current, Enabled
Supply Current, Powerdown
All Outputs Unloaded, SHDN = VCC, VCC = 3.15V
SHDN = GND
25
-
0.3
25
-
1
LOGIC AND TRANSMITTER INPUTS
Input Logic Threshold Low
Input Logic Threshold High
Transmitter Input Hysteresis
TIN, SHDN
TIN, SHDN
VCC = 3.3V
VCC = 5.0V
Full
-
-
Full
2.0
-
Full
2.4
-
25
-
0.5
Input Leakage Current
RECEIVER OUTPUTS
TIN, SHDN
Full
-
±0.01
Output Voltage Low
Output Voltage High
RECEIVER INPUTS
IOUT = 1.6mA
IOUT = -1.0mA
Full
-
-
Full VCC -0.6 VCC -0.1
Input Voltage Range
Full
-25
-
Input Threshold Low
Input Threshold High
Input Hysteresis
VCC = 3.3V
VCC = 5.0V
VCC = 3.3V
VCC = 5.0V
25
0.6
1.2
25
0.8
1.5
25
-
1.5
25
-
1.8
25
-
0.5
Input Resistance
25
3
5
TRANSMITTER OUTPUTS
Output Voltage Swing
All Transmitter Outputs Loaded with 3kΩ to Ground
Full
±5.0
±5.4
Output Resistance
Output Short-Circuit Current
VCC = V+ = V- = 0V, Transmitter Output = ±2V
Full
300
10M
Full
-
±35
MAX
1
10
0.8
-
-
-
±1.0
0.4
-
25
-
-
2.4
2.4
-
7
-
-
±60
UNITS
mA
µA
V
V
V
V
µA
V
V
V
V
V
V
V
V
kΩ
V
Ω
mA
4