LMV324 Просмотр технического описания (PDF) - ON Semiconductor
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LMV324 Datasheet PDF : 20 Pages
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LMV321, LMV358, LMV324
SC−70
AAC MG
G
AAC
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
V358
A
L
Y
W
G
SOIC−8
8
V358
ALYWX
G
1
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
SOIC−14
14
LMV324
AWLYWWG
1
LMV324 = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
Y
= Year
WW = Work Week
G
= Pb−Free Package
MARKING DIAGRAMS
TSOP−5
Micro8
5
3ACAYWG
G
1
8
V358
AYWG
G
1
3AC = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
V358 = Specific Device Code
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
UDFN8
AC M
G
AC = Specific Device Code
M = Date Code
G
= Pb−Free Package
TSSOP−14
14
LMV
324
ALYW
1
LMV324 = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
PIN CONNECTIONS
SC70−5/TSOP−5
UDFN8/Micro8/SOIC−8
OUT A 1
1
5
OUT A 1
8 V+
+IN
V+
IN A− 2
2
V−
+
−
3
4
A
IN A− 2
−+
IN A+ 3
7 OUT B IN A+ 3
V+ 4
6 IN B− IN B+ 5
−IN
OUTPUT
B
+−
IN B− 6
V− 4
5 IN B+
(Top View)
OUT B 7
(Top View)
SOIC−14
−A+
+D−
B
C
(Top View)
14 OUT D OUT A 1
13 IN D− IN A− 2
12 IN D+ IN A+ 3
11 V−
V+ 4
10 IN C+ IN B+ 5
9 IN C−
IN B− 6
8 OUT C OUT B 7
TSSOP−14
−A+
+D−
B
C
14 OUT D
13 IN D−
12 IN D+
11 V−
10 IN C+
9 IN C−
8 OUT C
(Top View)
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