LX1670 Просмотр технического описания (PDF) - Microsemi Corporation
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LX1670 Datasheet PDF : 7 Pages
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LX1670
PRODUCT DATABOOK 1996/1997
5-BI T PROGRAMMABLE VOLTAGE REFERENCE
PRODUCTION DATA SHEET
A B S O L U T E M A X I M U M R AT I N G S (Note 1)
Supply Voltage (V ) .................................................................................... -0.3V to +15V
CC
PGOOD, D0-D3, D4, ENABLE, BLKEN ....................................................... -0.3V to VCC+0.3
VIDO, OVOUT, VSENSE ....................................................................................... -0.3V to +5V
OV ........................................................................................................................ -35mA
OUT
VIDO ........................................................................................................................... -5mA
Operating Junction Temperature
Plastic (D Package) ............................................................................................... 150°C
Storage Temperature Range .................................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) ............................................................. 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal. Pin
numbers refer to DIL packages only.
T H E R M A L D ATA
D PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
120°C/W
Junction Temperature Calculation: T = T + (P x θ ).
J
A
D
JA
The θJA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow
PACKAGE PIN OUTS
VIDO
VSENSE
PGOOD
OV OUT
ENABLE
BLKEN
GND
1 14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
D4B
D4
D3
D2
D1
D0
D PACKAGE
(Top View)
2
Copyright © 1997
Rev. 1.0 7/97
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