LX5506E Просмотр технического описания (PDF) - Microsemi Corporation
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LX5506E Datasheet PDF : 7 Pages
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INTEGRATED PRODUCTS
LX5506E
InGaP HBT 4 – 6GHz Power Amplifier
PRELIMINARY DATA SHEET
LQ
PACKAGE DIMENSIONS
16-Pin MLPQ Plastic (3mmx3mm EP)
A
F
B
E
H
G
I
D1
C
D
Dim
MILLIMETERS
MIN MAX
INCHES
MIN MAX
A
3.00 BSC
0.118 BSC
B
3.00 BSC
0.118 BSC
C 0.80 1.00 0.031 0.039
D 0.18 0.30 0.007 0.011
D1
0
0.05
0 0.002
E 1.30 1.55 0.051 0.061
F 0.18 0.30 0.007 0.011
G
0.50 BSC
0.019 BSC
H 1.30 1.55 0.051 0.061
I
0.30 0.50 0.011 0.020
Note:
1. Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm(.006”) on any side. Lead dimension shall not
include solder coverage.
Copyright 2000
Rev. 1.0, 2003-01-10
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 6
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