MC100EP139DWR2 Просмотр технического описания (PDF) - ON Semiconductor

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Компоненты Описание

производитель

MC100EP139DWR2

3.3V / 5VECL ÷2/4, ÷4/5/6 Clock Generation Chip

ON Semiconductor 

MC10EP139, MC100EP139

Table 3. ATTRIBUTES

Characteristics

Internal Input Pulldown Resistor

Internal Input Pullup Resistor

ESD Protection

Human Body Model

Machine Model

Charged Device Model

Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)

SOIC−20

TSSOP−20

QFN−20

Flammability Rating

Oxygen Index: 28 to 34

Transistor Count

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

Value

75 kW

N/A

> 2 kV

> 100 V

> 2 kV

Pb Pkg

Pb−Free Pkg

Level 1

Level 1

N/A

Level 3

Level 1

Level

UL 94 V−0 @ 0.125 in

758 Devices

Table 4. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Unit

VCC

PECL Mode Power Supply

VEE

NECL Mode Power Supply

VI

PECL Mode Input Voltage

NECL Mode Input Voltage

Iout

Output Current

VEE = 0 V

VCC = 0 V

VEE = 0 V

VCC = 0 V

Continuous

Surge

VI v VCC

VI w VEE

6

V

−6

V

6

V

−6

V

50

mA

100

mA

IBB

VBB Sink/Source

TA

Operating Temperature Range

Tstg

Storage Temperature Range

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

TSSOP−20

TSSOP−20

± 0.5

−40 to +85

−65 to +150

140

100

mA

°C

°C

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case) Standard Board

TSSOP−20

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

SOIC−20

SOIC−20

23 to 41

90

60

°C/W

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case) Standard Board

SOIC−20

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

QFN−20

QFN−20

33 to 35

90

60

°C/W

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case) Standard Board

QFN−20

Tsol

Wave Solder

Pb <2 to 3 sec @ 248°C

Pb−Free <2 to 3 sec @ 260°C

33 to 35

265

265

°C/W

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

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