MC33362 Просмотр технического описания (PDF) - ON Semiconductor
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MC33362 Datasheet PDF : 14 Pages
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MC33362
10
ID = 200 mA
8.0
6.0
4.0
2.0
0
−50 −25
Pulse tested at 5.0 ms with < 1.0% duty cycle
so that TJ is as close to TA as possible.
0 25 50 75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Figure 13. Power Switch Drain−Source
On−Resistance versus Temperature
200
VCC = 20 V
TA = 25°C
150
100
50
COSS measured at 1.0 MHz with 50 mVpp.
0
0.5
5.0
50
500
VDS, DRAIN−SOURCE VOLTAGE (V)
Figure 14. Power Switch
Drain−Source Capacitance versus Voltage
4.0
CT = 390 pF
3.2
2.4
CT = 2.0 nF
1.6
RT = 10 k
Pin 1 = Open
0.8
Pin 4, 5, 10, 11,
12, 13 = GND
TA = 25°C
0
0
10
20
30
40
VCC, SUPPLY VOLTAGE (V)
Figure 15. Supply Current versus Supply Voltage
100
2.8
PD(max) for TA = 50°C
90
2.4
80
70
60
Printed circuit board heatsink example
ÎÎÎÎÎ L
2.0 oz
Copper
ÎÎÎÎÎ L
3.0 mm
2.0
1.6
1.2
50
Graphs represent symmetrical layout 0.8
RqJA
40
0.4
30
0
0
10
20
30
40
50
L, LENGTH OF COPPER (mm)
Figure 17. DW Suffix (SOP−16L) Thermal Resistance and
Maximum Power Dissipation versus P.C.B. Copper Length
100
L = 12.7 mm of 2.0 oz.
copper. Refer to Figures
17 and 18.
10
1.0
0.01
0.1
1.0
10
100
t, TIME (s)
Figure 16. DW and P Suffix Transient
Thermal Resistance
100
80
60
RqJA
5.0
Printed circuit board heatsink example
ÎÎÎÎÎÎÎÎÎÎ L
2.0 oz
Copper
4.0
ÎÎÎÎÎ L
3.0 mm
Graphs represent symmetrical layout
3.0
40
2.0
20
PD(max) for TA = 70°C
1.0
0
0
0
10
20
30
40
50
L, LENGTH OF COPPER (mm)
Figure 18. P Suffix (DIP−16) Thermal Resistance and
Maximum Power Dissipation versus P.C.B. Copper Length
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6
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