NCP5500, NCV5500, NCP5501, NCV5501
ABSOLUTE MAXIMUM RATINGS
TA = −40°C to +85°C (NCP5500, NCP5501), TA = −40°C to +125°C (NCV5500, NCV5501), unless otherwise noted.
Pin Symbol, Parameter
Symbol
Min
Max
Units
IN, VIN, DC Input Voltage
OUT, EN, VOUT, VEN, DC Voltage
VIN
−7.0
V
−0.3
+18
V
+16
V
VIN + 0.3
(Note 4)
Junction Temperature
Package Dissipation
DPAK 5
Power Dissipation at TA = 25°C
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
TJ
PD
RqJA
RqJC
+150
Internally Limited
75
8.0
°C
°C/W
DPAK
Power Dissipation at TA = 25°C
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Storage Temperature
Moisture Sensitivity Level
PD
RqJA
RqJC
TStg
MSL
Internally Limited
101
6.6
−55
+150
°C
1
−
ESD Capability, Human Body Model (Note 1)
ESD Capability, Machine Model (Note 1)
ESD Capability, Charged Device Model (Note 1)
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb−Free Versions (Note 3)
OPERATING RANGES
ESDHBM
ESDMM
ESDCDM
Tsld
4000
200
1000
−
V
−
V
−
V
°C
265 Peak
IN, VIN, Operating DC Input Voltage
VIN
VOUT + VDO, 2.5 V
16
V
(Note 5)
OUT, VOUT Adjust Range (adjustable version only)
VOUT
1.25
5.0
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model
2. Latch−up Current Maximum Rating: ≤ 100 mA per JEDEC standard: JESD78.
3. Pb−Free, 60 sec –150 sec above 217°C, 40 sec max at peak temperature
4. Maximum = +16 V or (VIN +0.3 V), whichever is lower.
5. Minimum VIN = 2.5 V or (VOUT + VDO), whichever is higher.
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