PCF8531 Просмотр технического описания (PDF) - NXP Semiconductors.
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PCF8531 Datasheet PDF : 51 Pages
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NXP Semiconductors
PCF8531
34 x 128 pixel matrix driver
PCF8531
Product data sheet
Table 5. Bonding pad description …continued
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip (see Figure 2).
Symbol
Pad
X (μm) Y (μm) Description
C28
132
−2566.4 −821.7 LCD column driver output
C29
133
−2496.4 −821.7
C30
134
−2426.4 −821.7
C31
135
−2356.4 −821.7
C32
136
−2216.4 −821.7
C33
137
−2146.4 −821.7
C34
138
−2076.4 −821.7
C35
139
−2006.4 −821.7
C36
140
−1936.4 −821.7
C37
141
−1866.4 −821.7
C38
142
−1796.4 −821.7
C39
143
−1726.4 −821.7
C40
144
−1656.4 −821.7
C41
145
−1586.4 −821.7
C42
146
−1516.4 −821.7
C43
147
−1446.4 −821.7
C44
148
−1376.4 −821.7
C45
149
−1306.4 −821.7
C46
150
−1236.4 −821.7
C47
151
−1166.4 −821.7
C48
152
−1096.4 −821.7
C49
153
−1026.4 −821.7
C50
154
−956.4 −821.7
C51
155
−886.4 −821.7
C52
156
−816.4 −821.7
C53
157
−746.4 −821.7
C54
158
−676.4 −821.7
C55
159
−606.4 −821.7
C56
160
−534.6 −821.7
C57
161
−466.4 −821.7
C58
162
−396.4 −821.7
C59
163
−326.4 −821.7
C60
164
−256.4 −821.7
C61
165
−186.4 −821.7
C62
166
−116.6 −821.7
C63
167
−46.4
−821.7
C64
168
93.6
−821.7
C65
169
163.6
−821.7
C66
170
233.6
−821.7
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 May 2011
© NXP B.V. 2011. All rights reserved.
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