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2.5W × 2 Class AB Audio Power Amplifier
PT2305
PACKAGE THERMAL CHARACTERISTIC
PACKAGE TYPE: TSSOP, 20PINS, 173MIL
Parameter
From chip conjunction dissipation to
external environment
From chip conjunction dissipation to
package surface
Symbol
θJA
θJC
Condition
Ta=45℃
Value
68.66
22.94
Unit
℃/W
℃/W
PACKAGE TYPE: SOP, 20PINS, 300MIL
Parameter
Symbol
From chip conjunction dissipation to
external environment
θJA
From chip conjunction dissipation to
package surface
θJC
Condition
Ta=45℃
Value
45.44
27.00
Unit
℃/W
℃/W
PT2305 V1.1
- 10 -
May, 2005