PTN3331 Просмотр технического описания (PDF) - Philips Electronics

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PTN3331

High speed differential line driver

Philips Electronics 

Philips Semiconductors

PTN3331

High speed differential line driver

During placement and before soldering, the package must be fixed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the

need for removal of corrosive residues in most applications.

14.4 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low

voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time

must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 to 5 seconds between 270 and 320 °C.

14.5 Package related soldering information

Table 8: Suitability of surface mount IC packages for wave and reflow soldering

methods

Package[1]

Soldering method

Wave

Reflow[2]

BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable

suitable

HBCC, HBGA, HLQFP, HSQFP, HSOP,

HTQFP, HTSSOP, HVQFN, HVSON, SMS

not suitable[3]

suitable

PLCC[4], SO, SOJ

suitable

suitable

LQFP, QFP, TQFP

not recommended[4][5]

suitable

SSOP, TSSOP, VSO

not recommended[6]

suitable

[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note

(AN01026); order a copy from your Philips Semiconductors sales office.

[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal

or external package cracks may occur due to vaporization of the moisture in them (the so called

popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated

Circuit Packages; Section: Packing Methods.

[3] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom

side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with

the heatsink on the top side, the solder might be deposited on the heatsink surface.

[4] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[5] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it

is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[6] Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

15. Revision history

Table 9: Revision history

Rev Date

CPCN

Description

01 20020806 -

Product data. Initial version. Engineering Change Notice 853-2362 28701 dated

2002 August 06.

9397 750 08339

Product data

Rev. 01 — 06 August 2002

© Koninklijke Philips Electronics N.V. 2002. All rights reserved.

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