Philips Semiconductors
PTN3341
High speed differential line driver
13. Package outline
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
c
y
Z
16
9
E
A
X
HE
vM A
pin 1 index
1
e
8
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (2)
e
HE
mm
1.10
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
SOT403-1
MO-153
L
Lp
Q
1.0
0.75
0.50
0.4
0.3
v
w
y
Z (1) θ
0.2 0.13 0.1
0.40
0.06
8o
0o
EUROPEAN
PROJECTION
ISSUE DATE
95-04-04
99-12-27
Fig 7. TSSOP16 package outline (SOT403-1).
9397 750 08483
Product data
Rev. 01 — 6 August 2002
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
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