STPS1045BY-TR Просмотр технического описания (PDF) - STMicroelectronics
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STPS1045BY-TR Datasheet PDF : 8 Pages
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Characteristics
STPS1045B-Y
Figure 7.
Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 8.
IR(µA)
1E+5
1E+4
1E+3
1E+2
1E+1
Tj=150°C
Tj=125°C
Tj=100°C
Tj=75°C
Tj=50°C
Tj=25°C
1E+0
1E-1
0
VR(V)
5
10
15
20
25
30
35
40
45
C(pF)
1000
500
200
100
1
Junction capacitance versus
reverse voltage applied
(typical values)
F=1MHz
VOSC=30mVRMS
Tj=25°C
VR(V)
2
5
10
20
50
Figure 9. Forward voltage drop versus
forward current
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab
IFM(A)
100.0
Tj=125°C
(maximum values)
10.0
Tj=125°C
(typical values)
1.0
Tj=25°C
(maximum values)
Rth(j-a)(°C/W)
100
Epoxy printed circuit board, copper thickness: 35 µm
80
60
40
VFM(V)
0.1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
20
S(Cu)(cm2)
0
0
2
4
6
8
10
12
14
16
18
20
4/7
Doc ID 17265 Rev 1
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