T491V108K035AT Просмотр технического описания (PDF) - KEMET

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T491V108K035AT

Surface Mount Capacitors

KEMET 

SOLID TANTALUM CHIP CAPACITORS

TANTALUM MnO2 COMPONENT PERFORMANCE CHARACTERISTICS (con’t.)

35. Soldering

KEMET’s families of surface mount tantalum

capacitors are compatible with wave (single or

dual) soldering and IR or vapor phase reflow

techniques. Solder-coated terminations have

excellent wetting characteristics for high integrity

solder fillets. Preheating of these components is

recommended to avoid extreme thermal stress.

Figure 13 represents recommended maximum

solder temperature / time combinations for these

devices.

Note that although the X/7343-43 case size can

withstand wave soldering, the tall profile (4.3mm

maximum) dictates care in wave process devel-

opment.

During typical reflow operations a slight darken-

ing of the gold-colored epoxy may be observed.

This slight darkening is normal and is not harmful

to the product. Marking permanency is not affect-

ed by this change.

36. Washing

Standard washing techniques and solvents are

compatible with all KEMET surface mount tanta-

lum capacitors. Solvents such as Freon TMC and

TMS, Trichlorethane, methylene chloride, prelete,

and isopropyl alcohol are not harmful to these

components.

If ultrasonic agitation is utilized in the cleaning

process, care should be taken to minimize ener-

gy levels and exposure times to avoid damage to

the terminations.

Sn-Pb Profile

300

250

5 Sec.

KEMET tantalum chips are also compatible with

newer aqueous and semi-aqueous processes.

Please follow the recommendations for cleaning

as defined by the solder vendor.

200

150

45 Sec. 45 Sec.

100

90 Sec.

50

95 Sec.

0

0

50

100

150

200

250

300

60 Sec.

Time (Seconds)

Pb-Free Profile

260˚C Peak Temperature (3 passes)

37. Encapsulations

Under normal circumstances, potting or encap-

sulation of KEMET tantalum chips is not required.

38. Storage Environment

Tantalum chip capacitors should be stored in

normal working environments. While the chips

themselves are quite robust in other environ-

ments, solderability will be degraded by expo-

sure to high temperatures, high humidity, corro-

sive atmospheres, and long term storage. In

addition, packaging materials will be degraded

by high temperature – reels may soften or warp,

and tape peel force may increase. KEMET rec-

ommends that maximum storage temperature

not exceed 40 degrees C, and maximum storage

humidity not exceed 60% relative humidity. In

addition, temperature fluctuations should be

minimized to avoid condensation on the parts,

and atmospheres should be free of chlorine and

sulfur bearing compounds. For optimized solder-

ability, chip stock should be used promptly,

preferably within 3 years of receipt.

FIGURE 13 Time/Temperature Soldering Profile

Hand-soldering should be performed with care

due to the difficulty in process control. If per-

formed, care should be taken to avoid contact of

the soldering iron to the molded case. The iron

should be used to heat the solder pad, applying

solder between the pad and the termination, until

reflow occurs. The iron should be removed.

“Wiping” the edges of a chip and heating the top

surface is not recommended.

39. Component Weights

• T49x, T510 Series

Series

T49x

T49x

T49x

T49x

T49x

T49x

T49x

T49x

T49x

T49x

T49x

T510

T510

T510

Case Size

A/3216-18

B/3528-21

C/6032-28

D/7343-31

X/7343-43

E/7360-38

R/2012-12

S/3216-12

T/3528-12

U/6032-15

V/7343-20

D/7343-31

X/7343-43

E/7360-38

Typical Weight

(mg)

32

60

130

320

500

600

10

21

34

70

206

338

510

645

14

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

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