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SOLDER PROFILES
300
5s
250 235 °C to
260 °C
200
Wirst wave
ca. 200 K/s
150
100 °C to
130 °C
100
Axis Title
Lead temperature
Second
wave
ca. 2 K/s
Full line: typical
Dotted lines:
process limits
2 K/s
ca. 5 K/s
50
Forced cooling
10000
1000
100
948626
0
10
0
50
100
150
200
250
Time (s)
Fig. 22 - Wave Soldering Double Wave Profile
According to J-STD-020 for DIP Devices
Axis Title
300
10000
250 255 °C
240 °C
217 °C
200
150
Max. 120 s
100
Max. 260 °C
245 °C
Max. 30 s
1000
Max. 100 s
100
Max. ramp down 6 °C/s
50 Max. ramp up 3 °C/s
19841
0
10
0
50 100 150 200 250 300
Time (s)
Fig. 23 - Lead (Pb)-free Reflow Solder Profile
According to J-STD-020 for SMD Devices
VO617A
Vishay Semiconductors
HANDLING AND STORAGE CONDITIONS
ESD level: HBM class 2
Floor life: unlimited
Conditions: Tamb < 30 °C, RH < 85 %
Moisture sensitivity level 1, according to J-STD-020
Rev. 2.6, 26-Mar-18
9
Document Number: 83430
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000