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WM8956GEFL/V(2007) Просмотр технического описания (PDF) - Wolfson Microelectronics plc

Номер в каталоге
Компоненты Описание
производитель
WM8956GEFL/V
(Rev.:2007)
Wolfson
Wolfson Microelectronics plc 
WM8956GEFL/V Datasheet PDF : 80 Pages
First Prev 71 72 73 74 75 76 77 78 79 80
Preliminary Technical Data
PACKAGE DRAWING
FL: 32 PIN QFN PLASTIC PACKAGE 5 X 5 X 0.9 mm BODY, 0.50 mm LEAD PITCH
D
D2
DETAIL 1
25
32
L
24
1
EXPOSED
GROUND 6
PADDLE
4 INDEX AREA
(D/2 X E/2)
A
E2
17
8
16 15
9 b1
e
B
bbbM C A B
BOTTOM VIEW
2X
aaa C
2X
aaa C
TOP VIEW
A3
C
SEATING PLANE
SIDE VIEW
W
ccc C
A
0.08 C 5
A1
DETAIL 2
R = 0.3MM
EXPOSED
GROUND
PADDLE
A3
b
Exposed lead
T
H
G
Half etch tie bar
DETAIL 1
DETAIL 2
Symbols
MIN
A
0.80
A1
0
A3
b
0.18
D
D2
3.30
E
E2
3.30
e
G
H
L
0.30
T
W
Dimensions (mm)
NOM
MAX
NOTE
0.90
1.00
0.02
0.05
0.20 REF
0.25
0.30
1
5.00
3.45
3.55
2
5.00
3.45
3.55
2
0.50 BSC
0.213
0.1
0.40
0.50
0.1
0.2
aaa
bbb
ccc
REF:
Tolerances of Form and Position
0.15
0.10
0.10
JEDEC, MO-220, VARIATION VHHD-5.
NOTES:
1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.
2. FALLS WITHIN JEDEC, MO-220, VARIATION VHHD-5.
3. ALL DIMENSIONS ARE IN MILLIMETRES.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.
5. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
6. REFER TO APPLICATION NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
7. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
DM033.D
E
WM8956
w
PTD, July 2007, Rev 2.1
79

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