X88C75JSLIC Просмотр технического описания (PDF) - Xicor -> Intersil

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Компоненты Описание

производитель

X88C75JSLIC

Port Expander and E2 Memory

Xicor -> Intersil 

X88C75 SLIC® E2

PACKAGING INFORMATION

44-LEAD THIN QUAD FLAT PACK (TQFP) PACKAGE TYPE L

He

E

L1

PIN 1

D Hd

GAGE PLANE 0.25

e

b

7°±0°

C

A2

A1

DIM MILLIMETERS

MIN MAX

A1 0.05 0.15

A2 1.35 1.45

b 0.22 0.38

c 0.090 0.200

D 9.90 10.10

E 9.90 10.10

e

0.80 TYP

Hd 11.90 12.10

He 11.90 12.10

L1

1.00 TYP

INCHES

MIN MAX

0.002 0.006

0.053 0.057

0.009 0.015

0.004 0.008

0.390 0.398

0.390 0.398

0.031 TYP

0.468 0.476

0.468 0.476

0.039 TYP

NOTES:

1. GAGE PLANE DIMENSION IS IN MM.

2. LEAD COPLANARITY SHALL BE 0.10MM [0.004] MAXIMUM.

25

3926 ILL F36.4

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