LBM673-M1N2-25 Просмотр технического описания (PDF) - Unspecified

Номер в каталоге

Компоненты Описание

производитель

LBM673-M1N2-25

Hyper Mini TOPLED Hyper-Bright LED

Unspecified 

Empfohlenes Lötpaddesign8)Seite 16

Recommended Solder Pad8)page 16

Reflow Löten

Reflow Soldering

2.8 (0.110)

0.8 (0.031)

LB M673, LT M673

Padgeometrie

für verbesserte

Wärmeableitung

Paddesign

for improved

heat dissipation

Cu-Fläche > 16 mm 2

Cu-area > 16 mm 2

Lötstopplack

Solder resist

2.8 (0.110)

0.8 (0.031)

OHLPY978

2012-06-15

11

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