STS6DNF30V
THERMAL DATA
Rthj-amb Thermal Resistance Junction-ambient Max Single Operation
Thermal Resistance Junction-ambient Max Dual Operation
Tj
Max. Operating Junction Temperature
Tstg
Storage Temperature
78
62.5
150
–65 to 150
°C/W
°C/W
°C
°C
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
V(BR)DSS Drain-source
ID = 250 µA, VGS = 0
30
V
Breakdown Voltage
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating, TC = 125 °C
1
µA
10
µA
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ±12V
±100
nA
ON (1)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS, ID = 250µA
VGS = 4.5 V, ID = 3 A
VGS = 2.5 V, ID = 3 A
Min.
0.6
Typ. Max.
0.026
0.030
0.030
0.038
Unit
V
Ω
Ω
DYNAMIC
Symbol
gfs (1)
Parameter
Forward Transconductance
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS > ID(on) x RDS(on)max,
ID = 3 A
VDS = 25 V, f = 1 MHz, VGS = 0
Min.
Typ.
15
800
180
32
Max.
Unit
S
pF
pF
pF
2/8