NXP Semiconductors
74LVT16374A; 74LVTH16374A
3.3 V 16-bit edge-triggered D-type flip-flop; 3-state
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
SOT362-1
D
y
Z
48
c
25
E
A
X
HE
vM A
pin 1 index
1
e
A2
A1
24
wM
bp
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions).
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
L
Lp
Q
v
w
y
Z
θ
mm
1.2
0.15
0.05
1.05
0.85
0.25
0.28
0.17
0.2
0.1
12.6
12.4
6.2
6.0
0.5
8.3
7.9
1
0.8
0.4
0.50
0.35
0.25
0.08
0.1
0.8
0.4
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT362-1
REFERENCES
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 12. Package outline SOT362-1 (TSSOP48)
74LVT_LVTH16374A_7
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 07 — 22 March 2010
© NXP B.V. 2010. All rights reserved.
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