AD8016
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configurations ........................................................................... 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Logic Inputs (CMOS Compatible Logic) .................................. 4
Absolute Maximum Ratings............................................................ 5
Maximum Power Dissipation ..................................................... 5
ESD Caution.................................................................................. 5
Pin Configurations and Function Descriptions ........................... 6
Typical Performance Characteristics ............................................. 7
Test Circuts ...................................................................................... 13
Theory of Operation ...................................................................... 14
Power Supply and Decoupling.................................................. 14
REVISION HISTORY
3/12—Rev. B to Rev. C
Updated Format..................................................................Universal
Deleted PSOP Package and Evaluation Boards (Throughout)... 1
Added Pin Configurations and Function Descriptions Sections .. 7
Updated Outline Dimensions ....................................................... 21
Changes to Ordering Guide .......................................................... 19
11/03—Rev. A to Rev. B
Changes to Ordering Guide ............................................................ 4
Changes to TPC 21 ........................................................................... 8
Updated Outline Dimensions ..................................................19-20
Data Sheet
Feedback Resistor Selection ...................................................... 14
Bias Pin and PWDN Features................................................... 14
Thermal Shutdown .................................................................... 15
Applications Information .............................................................. 16
Multitone Power Ratio (MTPR)............................................... 16
Generating DMT ........................................................................ 17
Power Dissipation....................................................................... 17
Thermal Enhancements and PCB Layout............................... 18
Thermal Testing.......................................................................... 18
Air Flow Test Conditions .......................................................... 18
Experimental Results ................................................................. 19
Outline Dimensions ....................................................................... 20
Ordering Guide .......................................................................... 20
Rev. C | Page 2 of 20