MC33076D(2006) Просмотр технического описания (PDF) - ON Semiconductor
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Компоненты Описание
производитель
MC33076D
(Rev.:2006)
(Rev.:2006)
ON Semiconductor
MC33076D Datasheet PDF : 10 Pages
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100
VCC = +15 V
80
VEE = −15 V
TA = 25°C
60
40
20
RL = 2.0 kΩ
RL = 100 Ω
0
10
100
1000
CL, LOAD CAPACITANCE (pF)
Figure 26. Percent Overshoot
versus Load Capacitance
MC33076
Copper
Pad
Copper
Pad
10 k
Figure 27. PC Board Heatsink Example
APPLICATIONS INFORMATION
The MC33076 dual operational amplifier is available in
the standard 8−pin plastic dual−in−line (DIP) and surface
mount packages, and also in a 16−pin batwing power
package. To enhance the power dissipation capability of the
power package, Pins 4, 5, 12, and 13 are tied together on the
leadframe, giving it an ambient thermal resistance of
52°C/W typically, in still air. The junction−to−ambient
thermal resistance (RθJA) can be decreased further by using
a copper padb on the printed circuit board (as shown in
Figure 27) to draw the heat away from the package. Care
must be taken not to exceed the maximum junction
temperature or damage to the device may occur.
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