MC145503P Просмотр технического описания (PDF) - LANSDALE Semiconductor Inc.
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MC145503P Datasheet PDF : 26 Pages
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ML145502, ML145503, ML145505
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
–A–
16
9
SO 16 = -5P
(ML145503-5P, ML145505-5P)
SOG PACKAGE
CASE 751G–02
–B–
8X P
0.010 (0.25) M B M
1
8
16X D
J
0.010 (0.25) M T A S B S
F
14X G
C
–T–
K
SEATING
PLANE
R X 45
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 10.15 10.45 0.400 0.411
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
G
1.27 BSC
0.050 BSC
J 0.25 0.32 0.010 0.012
K 0.10 0.25 0.004 0.009
M
0
7
0
7
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabil-
ity, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the cus-
tomer’s technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
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