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P4KE530 Просмотр технического описания (PDF) - General Semiconductor

Номер в каталоге
Компоненты Описание
производитель
P4KE530
GE
General Semiconductor 
P4KE530 Datasheet PDF : 2 Pages
1 2
MAXIMUM RATINGS AND CHARACTERISTIC CURVES P4KE530 AND P4KE550
FIG. 1 - PEAK PULSE POWER RATING CURVE
100
NON-REPETITIVE
PULSE WAVEFORM
SHOWN in FIG. 3
TA=25°C
10
FIG. 2 - PULSE DERATING CURVE
100
75
1.0
50
0.1
0.1µs
150
100
50
1.0µs
10µs
100µs
td, PULSE WIDTH, sec.
1.0ms
10ms
FIG. 3 - PULSE WAVEFORM
tr=10µsec.
PULSE WIDTH (td) is DEFINED
as the POINT WHERE the PEAK
CURRENT DECAYS
to 50% of IPPM
PEAK VALUE
IPPM
HALF VALUE - IPPM
2
10/1000µsec. WAVEFORM
as DEFINED by R.E.A.
td
0
0
1.0
2.0
3.0
4.0
t, TIME, ms
25
0
0 25 50 75 100 125 150 175
TA, AMBIENT TEMPERATURE, °C
10,000
1,000
APPLICATION NOTES
Respect Thermal Resistance (PCB Layout) - as the temperature coefficient also
contributes to the clamping voltage.
Select minimum breakdown voltage, so you get acceptable power dissipation and
PCB tie point temperature. Devices with higher breakdown voltage will have a
shorter conduction time and will dissipate less power.
Clamping voltage is influenced by internal resistance - design approximation is
7V per 100mA slope.
Keep temperature of TVS lower than TOPSwitch® as a recommendation.
Maximum current is determined by the maximum TJ and can be higher than
300mA. Contact supplier for different clamping voltage / current arrangements.
Minimum breakdown voltage can be customized for other applications.
Contact supplier.

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