PEMD2(2008) Просмотр технического описания (PDF) - NXP Semiconductors.
Номер в каталоге
Компоненты Описание
производитель
PEMD2 Datasheet PDF : 16 Pages
| |||
NXP Semiconductors
PEMD2; PIMD2; PUMD2
NPN/PNP resistor-equipped transistors; R1 = 22 kΩ, R2 = 22 kΩ
Table 6. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Per device
Ptot
total power dissipation Tamb ≤ 25 °C
[1]
PEMD2 (SOT666)
[2] -
PIMD2 (SOT457)
-
PUMD2 (SOT363)
-
Max Unit
300
mW
600
mW
300
mW
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
Table 7. Thermal characteristics
Symbol Parameter
Per transistor
Rth(j-a)
thermal resistance from
junction to ambient
PEMD2 (SOT666)
PIMD2 (SOT457)
PUMD2 (SOT363)
Per device
Rth(j-a)
thermal resistance from
junction to ambient
PEMD2 (SOT666)
PIMD2 (SOT457)
PUMD2 (SOT363)
Conditions
in free air
in free air
Min Typ Max
[1]
[2] -
-
625
-
-
417
-
-
625
[1]
[2] -
-
416
-
-
208
-
-
416
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
Unit
K/W
K/W
K/W
K/W
K/W
K/W
PEMD2_PIMD2_PUMD2_7
Product data sheet
Rev. 07 — 24 September 2008
© NXP B.V. 2008. All rights reserved.
4 of 16
Share Link: 