LB11961-TLM-H(2016) Просмотр технического описания (PDF) - ON Semiconductor
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LB11961-TLM-H Datasheet PDF : 8 Pages
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Package Dimensions
unit : mm
HSSOP14 (225mil)
CASE 944AA
ISSUE A
LB11961
SOLDERING FOOTPRINT*
5.80
1.0
(Unit: mm)
0.32
0.65
NOTES: 1. The measurements are not to guarantee but for reference only.
2. Land pattern design in Fin area to be altered in response to
customer’s individual application.
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