ADM7171ACPZ-R7 Просмотр технического описания (PDF) - Analog Devices
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ADM7171ACPZ-R7 Datasheet PDF : 23 Pages
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Data Sheet
155
145
135
125
115
105
95
85
6400mm 2
500mm2
75
25mm2
TJ MAX
65
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
TOTAL POWER DISSIPATION (W)
Figure 65. LFCSP, TA = 85°C
In the case where the board temperature is known, use the
thermal characterization parameter, ΨJB, to estimate the
junction temperature rise. Maximum junction temperature (TJ)
is calculated from the board temperature (TB) and power
dissipation (PD) using the following formula:
TJ = TB + (PD × ΨJB)
(5)
ADM7171
160
140
120
100
80
60
40
TB = 25°C
TB = 50°C
20
TB = 65°C
TB = 85°C
TJ MAX
0
0
1
2
3
4
5
6
7
8
9
TOTAL POWER DISSIPATION (W)
Figure 66. LFCSP Power Dissipation for Various Board Temperatures
TYPICAL APPLICATIONS CIRCUITS
4V TO 6.5V
ADM7171
6.5V, 1A
LDO
3.3V
HIGH
SPEED
CLOCK
DRIVER
Figure 67. Clock Driver Power
4V TO 6.5V
ADM7171
6.5V, 1A
LDO
3.3V
ADM7171
6.5V, 1A
LDO
3.3V
VVCO
DVDD
AVDD
ADF4350
Figure 68. RF PLL/VCO Power
Rev. A | Page 21 of 23
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