ADM7170ACPZ Просмотр технического описания (PDF) - Analog Devices
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ADM7170ACPZ Datasheet PDF : 23 Pages
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Data Sheet
160
150
140
130
120
110
100
90
80
6400mm 2
70
500mm2
60
25mm2
TJ MAX
50
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
TOTAL POWER DISSIPATION (W)
Figure 64. LFCSP, TA = 50°C
155
145
135
125
115
105
95
85
6400mm 2
500mm2
75
25mm2
TJ MAX
65
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
TOTAL POWER DISSIPATION (W)
Figure 65. LFCSP, TA = 85°C
In the case where the board temperature is known, use the
thermal characterization parameter, ΨJB, to estimate the
junction temperature rise. Maximum junction temperature (TJ)
is calculated from the board temperature (TB) and power
dissipation (PD) using the following formula:
TJ = TB + (PD × ΨJB)
(5)
ADM7170
160
140
120
100
80
60
40
TB = 25°C
TB = 50°C
20
TB = 65°C
TB = 85°C
TJ MAX
0
0
1
2
3
4
5
6
7
8
9
TOTAL POWER DISSIPATION (W)
Figure 66. LFCSP Power Dissipation for Various Board Temperatures
TYPICAL APPLICATIONS CIRCUITS
4V TO 6.5V
ADM7170
6.5V, 500mA
LDO
3.3V
HIGH
SPEED
CLOCK
DRIVER
4V TO 6.5V
Figure 67. Clock Driver
ADM7170 3.3V
6.5V, 500mA
LDO
ADM7170 3.3V
6.5V, 500mA
LDO
VVCO
DVDD
AVDD
ADF4350
Figure 68. RF PLL/VCO Power
Rev. C | Page 21 of 23
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