GQM1885C2AR75CB01D Просмотр технического описания (PDF) - Murata Manufacturing
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GQM1885C2AR75CB01D Datasheet PDF : 220 Pages
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09.9.18 • This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Continued from the preceding page.
4. Reflow Soldering
When sudden heat is given to the components, the
mechanical strength of the components should go down
because remarkable temperature change causes
deformity of components inside. In order to prevent
mechanical damage in the components, preheating
should be required for both of the components and the
PCB board. Preheating conditions are shown in Table 1.
It is required to keep temperature differential between the
soldering and the components surface (∆T) as small as
possible.
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profile
where peak solder temperature is below the Tin melting
point is used. Please confirm the solderability of Tin
plating termination chip before use.
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
(∆T) between the component and solvent within the
range shown in the Table 1.
Table 1
Part Number
G--18/21/31
G--32/42/43/52/55
Temperature Differential
∆TV190D
∆TV130D
Recommended Conditions
Pb-Sn Solder
Lead Free Solder
Infrared Reflow Vapor Reflow
Peak Temperature 230-250°C 230-240°C
240-260°C
Atmosphere
Air
Air
Air or N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
!Caution
[Standard Conditions for Reflow Soldering]
Infrared Reflow
Temperature (D)
Peak Temperature
200°C
,,, ∆T
170°C
150°C
,,,,,, 130°C
Preheating
Soldering
Gradual
Cooling
Time
60-120 seconds 30-60 seconds
Vapor Reflow
Temperature (D)
Peak Temperature
,,, ∆T
170°C
,,, 150°C
,,, 130°C
Preheating
Soldering
Gradual
Cooling
Time
60-120 seconds 20 seconds max.
[Allowable Soldering Temperature and Time]
270
,,, 260
250
,,, 240
,,, 230
0
30
60
90
Soldering Time (sec.)
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Optimum Solder Amount for Reflow Soldering
Overly thick application of solder paste results in
excessive fillet height solder.
This makes the chip more susceptible to mechanical and
thermal stress on the board and may cause cracked
chips.
Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in chips
breaking loose from the PCB.
Make sure the solder has been applied smoothly to the
end surface to a height of 0.2mm min.
[Optimum Solder Amount for Reflow Soldering]
0.2mm min.
in section
18
Inverting the PCB
Make sure not to impose an abnormal mechanical shock on
the PCB.
Continued on the following page.
211
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