STN1110 Просмотр технического описания (PDF) - Unspecified
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STN1110 Datasheet PDF : 22 Pages
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STN1110
8.2 SOIC 300mil (SO) Package
28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
D
N
NOTE 1
123
b
A
A1
E
E1
e
h
α
h
φ
c
A2
L
L1
β
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
Units
Dimension Limits
N
e
A
A2
A1
E
E1
D
h
L
L1
φ
c
b
α
β
MILLIMETERS
MIN
NOM
MAX
28
1.27 BSC
—
—
2.65
2.05
—
—
0.10
—
0.30
10.30 BSC
7.50 BSC
17.90 BSC
0.25
—
0.75
0.40
—
1.27
1.40 REF
0°
—
8°
0.18
—
0.33
0.31
—
0.51
5°
—
15°
5°
—
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-052B
STN1110DSA
www.obdsol.com
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