74LV541 Просмотр технического описания (PDF) - NXP Semiconductors.
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74LV541 Datasheet PDF : 15 Pages
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NXP Semiconductors
74LV541
Octal buffer/line driver; 3-state
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
D
y
Z
20
c
11
E
A
X
HE
vM A
pin 1 index
1
e
10
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (2)
e
HE
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT360-1
MO-153
L
Lp
Q
v
w
y
Z (1) θ
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.5
0.2
8o
0o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 11. Package outline SOT360-1 (TSSOP20)
74LV541_3
Product data sheet
Rev. 03 — 14 April 2009
© NXP B.V. 2009. All rights reserved.
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