STPS1L30A(1999) Просмотр технического описания (PDF) - STMicroelectronics
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производитель
STPS1L30A Datasheet PDF : 5 Pages
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STPS1L30A/U
Fig. 8-1: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, copper thickness:
35µm) (SMB).
Rth(j-a) (°C/W)
120
100
80
60
40
20
S(Cu) (cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Fig. 8-2: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, copper thickness: 35µm)
(SMA).
Rth(j-a) (°C/W)
140
120
100
80
60
40
20
S(Cu) (cm²)
0
0
1
2
3
4
5
PACKAGE MECHANICAL DATA
SMA
E1
D
E
A1
C
A2
L
b
REF.
A1
A2
b
c
E
E1
D
L
DIMENSIONS
Millimeters
Inches
Min. Max. Min. Max.
1.90 2.70 0.075 0.106
0.05 0.20 0.002 0.008
1.25 1.65 0.049 0.065
0.15 0.41 0.006 0.016
4.80 5.60 0.189 0.220
3.95 4.60 0.156 0.181
2.25 2.95 0.089 0.116
0.75 1.60 0.030 0.063
FOOT PRINT DIMENSIONS (in millimeters)
1.65
1.45
2.40 1.45
4/5
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