STV0056 Просмотр технического описания (PDF) - STMicroelectronics
Номер в каталоге
Компоненты Описание
производитель
STV0056 Datasheet PDF : 26 Pages
| |||
STV0056A
PIN INTERNAL CIRCUITRY (continued)
AMPLK L, AMPLK R, AGC L, AGC R
I2 and I1 from the amplitude detecting mixer.
Figure 23
To VCA
AMPLK L
AMPLK R
I2
2
I1
5µA
AGC L
AGC R
10kΩ
VREF 2.4V
160µA
VREF
The 400µA source is off during stand-by mode.
Figure 24
Vbg 1.2V
4
10kΩ
VREF (2.4V)
10kΩ
400µA
LEVEL L, LEVEL R
Figure 25
VREF 2.4V
Audio
SW
49kΩ
49kΩ
GND 0V
50kΩ
1
100µA
LEVEL R
LEVEL L
PK IN L, PK IN R
Figure 26
VREF 2.4V
PK IN R
PK IN L
67kΩ
1
To Peak Det
100µA
V 12V
Doubled bonded (two bond wires and two pads for
one package pin) :
- One pad is connected to all of the 12V ESD and
video guard rings.
- The second pad is connected to power up the
video block.
16/26
V GND
Doubled bonded :
- One pad is connected to power-up all of the video
mux and I/O.
- The second pad is only as a low noise GND for
the video input.
VDD 5V, GND 5V
Connected to XTL oscillator and the bulk of the
CMOS logic and 5V ESD.
A GND
Doubled bonded :
- One pad connected to the left VCO, dividers,
mixers and guard ring. the guard connection is
star connected directly to the pad.
- The second pad is connected to both AGC amps
and the deemphasis amplifiers, frequency syn-
thesis and FM deviation selection circuit for both
channels.
A 12V
Doubled bonded :
- One pad connected to the ESD and guard ring.
- The second pad is connected to the main power
for all of the audio parts.
A GND R
Boubled bonded :
- One pad connected to the right VCO, dividers,
mixers and guard ring. The guard connection is
star connected directly to the pad.
- The second pad is connected to the bias block,
audio noise reduction, volume, mux and ESD.
A third bond wire on this pin is connected directly
to the die pad (substrate).
Figure 27
V 12V
Video Pads
V GND
VDD 5V
Vpp
BIP 10vpl
Vmm
Digital Pads
GND 5V
A GND L
A 12V
Audio Pads
Substrate
A GND R
205Ω
+
BIP
12V
-
DZPN1
DZPN1
DZPN1
Share Link: 