NXP Semiconductors
BUK9510-55A
N-channel TrenchMOS logic level FET
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VDS
VDGR
VGS
ID
drain-source voltage
drain-gate voltage
gate-source voltage
drain current
Tj ≥ 25 °C; Tj ≤ 175 °C
RGS = 20 kΩ
VGS = 5 V; Tj = 25 °C; see Figure 3;
see Figure 1
VGS = 5 V; Tj = 25 °C; see Figure 1;
see Figure 3
IDM
peak drain current
VGS = 5 V; Tj = 100 °C; see Figure 1
Tmb = 25 °C; pulsed; tp ≤ 10 µs;
see Figure 3
Ptot
total power dissipation
Tstg
storage temperature
Tj
junction temperature
Source-drain diode
Tmb = 25 °C; see Figure 2
IS
source current
Tmb = 25 °C
ISM
peak source current
Avalanche ruggedness
EDS(AL)S
non-repetitive drain-source
avalanche energy
[1] Continuous current is limited by package.
[2] Current is limited by power dissipation chip rating.
pulsed; tp ≤ 10 µs; Tmb = 25 °C
ID = 75 A; Vsup ≤ 55 V; RGS = 50 Ω;
VGS = 5 V; Tj(init) = 25 °C; unclamped
Min
-
-
-15
[1] -
[2] -
[1] -
-
-
-55
-55
[2] -
[1] -
-
-
Max Unit
55 V
55 V
15 V
75 A
100 A
70 A
400 A
200 W
175 °C
175 °C
100 A
75 A
400 A
333 mJ
BUK9510-55A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 17 February 2011
© NXP B.V. 2011. All rights reserved.
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